The USB 3.0 specification, a next-generation high-speed connection standard is coming out way! The specs will be formally announced next Monday at the first SuperSpeed USB Developer Conference in San Jose, CA. It will then be handed over to early adopters who plan to design products utilizing the much faster USB 3.0.
Hewlett-Packard, Intel, NEC, NXP Semiconductors, Microsoft, and Texas Instruments are all backers of SuperSpeed USB.
Speaking at the Windows Hardware Engineering Conference (WinHEC) in Los Angeles, USB-IF President Jeff Ravencraft said he expects the final specifications to be made public on November 17.
Read more on Cnet.com.